Semiconductor & Electronics

A practical guide to acoustic resistance, port alignment, aperture geometry, sealing and process choice for thin metal mesh over MEMS microphones.

The shield is usually the last part designed and the first part to hold up a build. The board respins, components move, the vent pattern shifts — and the can no longer fits. Etched shields don't have that problem, because the shield is a drawing before it's anything else. Shielding is one of the four product lines Metching is built around. From our Dongguan plant, etching electronics and semiconductor components since 2005, we make shielding cans, covers, lids and board-level

How to specify datum strategy, aperture registration, material, flatness and inspection for thin alignment masks used in silicon photonics test fixtures.

A package drawing lands on our desk. The silicon schedule is set, qualification has a date, and nobody has budgeted for a progressive die yet. That gap — between a finished drawing and a justified die — is where etched lead frames earn their keep. Metching is a Dongguan etching plant working on electronics and semiconductor components since 2005. Lead frames are one of our core lines. We etch them in copper and stainless steel from 0.05 to 2.5 mm thick, straight off the packa

A practical DFM guide to contact-clearance geometry, datum selection, flatness and process choice for thin metal ground planes used in IC test sockets.

FMM-less OLED patterning changes the industry discussion, but etched metal masks still have roles where aperture bias, tension, sag and registration are controlled.

Husqvarna's FCC approval for four Automower platforms highlights the shielding, grounding and position-feedback challenges inside increasingly connected outdoor robots.

A semiconductor gas distribution plate succeeds only when hole geometry, open area, flatness and chamber integration are designed as one flow-control system.

Apple officially confirms a titanium support plate beneath iPhone Duo's inner display and a custom vapor chamber. This article examines where titanium photo etching could realistically fit—and where it may not.

Thin spacer frames can stabilize a packaging or test stack, but only when material, thickness, flatness, cutout geometry and assembly load are specified together.

Copper supports excellent electrical and thermal performance, but fine-pitch parts require careful control of thickness, narrow webs, flatness and surface finish.

A spring contact must carry current and recover mechanically. Material temper, bend geometry, contact force and plating must be designed as one system.

Power-electronics packages place demanding electrical, thermal and assembly requirements on thin copper lead frames. Here is what to review before prototype tooling.

Board-level EMI shields look simple until the PCB gets crowded. A practical engineering guide to material, vents, bend lines, grounding tabs, tolerances, and when photo etching makes sense.